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| Approved by: Checked by: Issued by: SPECIFICATION PRODUCT: MODEL: SAW FILTER HDF480A TO-39 SHOULDER ELECTRONICS LIMITED SHOULDER ELECTRONICS LIMITED 1. SCOPE This specification shall cover the characteristics of SAW filter with 480MHz used for DBS receiver. 2. ELECTRICAL SPECIFICATION DC Voltage VDC AC Voltage Vpp Operation temperature Storage temperature RF Power Dissipation 10V 10V50Hz/60Hz -20aeto +60ae -45aeto +85ae 0dBm Electronic Characteristics 2-1.Typical frequency response 2-2.Electrical characteristics Part number Center frequency fo Insertion Loss: Fo: FoA 39.8~45.8MHz foA 45.8~100.0MHz Passband width( -3dB) Ripple(FoA 4.0MHz) Group delay Group delay ripple Input/Output impedance F480A 480.000 4.5max 45.0min 50.0min 9.0 type 2.0max 100 100 50//0 Unit MHz dB MHz dB ns ns | //pF SHOULDER ELECTRONICS LIMITED (Note: Operating te mperature Range:-20aeto +60ae ) 3.TEST CIRCUIT 4. DIMENSION 5. ENVIRONMENTAL CHARACTERISTICS 5-1 High temperature exposure Subject the device to +85aefor 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in table 1. 5-2 Low temperature exposure SHOULDER ELECTRONICS LIMITED Subject the device to -20aefor 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in table 1. 5-3 Temperature cycling Subject the device to a low temperature of -40ae 30 minutes. Following by for a high temperature of +80aefor 30 Minutes. Then release the device into the room conditions for 24 hours prior to the measurement. It shall meet the specifications in table 1. 5-4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260ae A 10aefor 10A sec. Then release the device into the room conditions for 4 1 hours. The device shall meet the specifications in table 1. 5-5 Solderability Subject the device terminals into the solder bath at 245aeA 5aefor 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in table 1. 5-6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in table 1. 5-7 Vibration Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in table 1. 5-8 Lead fatigue 5-8-1 Pulling test Weight along with the direction of lead without an shock 1kg. The device shall satisfy all the initial Characteristics. 5-8-2 Bending test Lead shall be subject to withstand against 90ae bending with 450g weight in the direction of thickness. This operation shall be done toward both direction. The device shall show no evidence of damage and shall satisfy all the initial electrical characteristics. 6. REMARK 6.1 Static voltage Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage. 6.2 Ultrasonic cleaning Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning 6.3 Soldering Only leads of component may be soldered. Please avoid soldering another part of component. |
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